US 5,700,548 AGranted

Multilayer film, multicolour screen-printing process for the manufacture of said multilayer film and the use of same

AssigneeU.S. Philips Corporation

InventorsJacques Warnier, Gerrit Van Der Beek, Hubertus Weerts

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Abstract

The invention relates to a multilayer film, in particular for the films for the manufacture of passive electronic components, the multilayer film having a small and uniform layer thickness, an improved layer structure and the method of manufacturing said films being simpler. In accordance with the invention, a multilayer film is proposed which comprises a green ceramic substrate film, inner electrodes provided by screen printing and one or more levelling layers which are provided on the whole area accommodating the green ceramic substrate film and the inner electrodes by means of screen printing. The inner electrodes and the levelling layer(s) are successively provided on the green ceramic substrate film by screen printing.

Claims8

Dependent claims

A multilayer film having a multilayer structure, in particular for passive electronic components, said multilayer film comprising a multilayer structure, wherein each layer is of uniform thickness, of:

a) a green ceramic substrate film comprising at least one ceramic component and a first binder preparation for said at least one ceramic component,
b) inner electrodes provided on a surface of said substrate film by screen printing, each of said electrodes comprising at least one metallic component and, optionally, both ceramic filling agents and a second binder preparation for said ceramic filing agents, and
c) at least one leveling layer comprising one or more ceramic components and a third binder preparation for said at least one ceramic component provided by screen printing in a manner so as to completely cover said inner electrodes and evenly fill up the interstices between the inner electrodes to thereby completely cover said surface of said substrate film.

Dependencies are inferred from the claim text.

Facts

Application: 08/796,406Filed 6 Feb 1997 · continuation
Priority: DE 43 34 059.86 Oct 1993
Granted: 23 Dec 1997
Term ends: Not estimatedThe source records don’t support an estimate.

Classification14 codes

H10N 30/074
Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base: by depositing piezoelectric or…
H01C 17/065
Adapted for coating resistive material on a base: by thick film techniques, e.g. serigraphy
H01G 4/30
Fixed capacitors; Processes of their manufacture: stacked capacitors
H10N 30/053
Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes: by…

Family

Serial318,419Parent of this continuation · filed 5 Oct 1994
Serial556,299Parent of this continuation · filed 23 Oct 1995
US 5,700,548 AThis patent

From the US filing history. Foreign family members aren’t listed.

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