Method for producing ultra high purity titanium films
AssigneesSony Corporation, Materials Research Corporation
InventorRaymond K. F. Lam
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Abstract
A method is provided for depositing ultra high purity of greater than 99.998% titanium films which comprises generating gaseous TiI.sub.4 in situ by reacting titanium metal starting material with gaseous iodide in a reaction chamber, purifying the TiI.sub.4 by a double distillation process at reduced pressure to produce ultra high purity of greater than 99.998% TiI.sub.4, transferring the ultra high purity TiI.sub.4 in liquid form to a deposition chamber to vaporize the liquid TiI.sub.4 and contacting a heated titanium substrate with the TiI.sub.4 vapor, thereby depositing the ultra high purity Ti films on the substrate.
Claims11
A method of making ultra high purity titanium metal, comprising the steps of:
- generating gaseous TiI.sub.4 in situ by reacting titanium metal starting material with gaseous iodine in a reaction chamber under vacuum conditions, said reaction occurring at a steady state temperature in the range of about 500.degree.-750.degree. C.;
- transferring the gaseous reaction product TiI.sub.4 to a first distillation column;
- distilling said TiI.sub.4 in said first distillation column to remove lower volatility impurities, said first distillation column operated at a temperature in the range of about 150.degree.-370.degree. C. and at a pressure in the range of about 0.05-670 torr to produce partially pure TiI.sub.4 ;
- transferring the partially pure TiI.sub.4 to a second distillation column;
- distilling said partially pure TiI.sub.4 in said second distillation column to remove higher volatility impurities, said second distillation column operated at a temperature in the range of about 150.degree.-370.degree. C. and at a pressure in the range of about 0.05-670 torr to produce ultra high purity of greater than 99.998% TiI.sub.4 ;
- transferring the ultra high purity TiI.sub.4 in liquid form to a deposition chamber heated to a temperature of about 200.degree. C. to vaporize the liquid TiI.sub.4 ;
- and
- contacting a titanium deposition substrate located within the deposition chamber and heated to a temperature in the range of about 1100.degree.-1400.degree. C. with the ultra high purity TiI.sub.4 vapor, whereby said TiI.sub.4 decomposes and ultra high purity of greater than 99.998% titanium metal is deposited on said substrate.
Dependencies are inferred from the claim text.