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US 5,700,389 AGranted
Etching solution for copper or copper alloy
AssigneeMec Company Ltd.
InventorToshiko Nakagawa
Life of this patent
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Abstract
An etching solution for copper or copper alloys comprising, (a) sulfuric acid, (b) a persulfate, (c) at least one compound selected from imidazole, imidazole derivatives, pyridine derivatives, triazine, and triazine derivatives, and (d) water. The etching solution exhibits a high etching speed and does not oxidize the copper surfaces after etching.
Claims13
An etching solution for copper or copper alloys comprising:
- (a) sulfuric acid,
- (b) a persulfate,
- (c) at least one compound selected from the group consisting of imidazole, imidazole derivatives, pyridine derivatives in which the 2-position or 4-position thereof is substituted with an alkyl group, an amino group or a carboxyl group, triazine, and triazine derivatives,
- (d) water, and
- (e) amidosulfuric acid or an aliphatic sulfonic acid.
2 more elements
Dependencies are inferred from the claim text.