Method for fabricating a silicon semiconductor substrate having an integrated waveguide and an optical fiber coupled thereto
AssigneeSiemens Aktiengesellschaft
InventorArmin Splett
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AssigneeSiemens Aktiengesellschaft
InventorArmin Splett
Estimating the term…
A method for fabricating a silicon semiconductor substrate having an optical fiber coupled to an integrated waveguide by anisotropically etching a V-shaped groove aligned with the integrated waveguide into the substrate. The integrated waveguide is provided with a freely accessible end surface situated opposite the end of the V-shaped groove. The freely accessible end surface is formed by first producing a recess in the silicon semiconductor substrate. The recess is made by anisotropically etching a piece of the substrate from the surface opposite the surface bearing said V-shaped groove. The piece is bared down to a region surrounding said integrated waveguide but the piece remains connected to the waveguide by a V-shaped notch. Then pressure is exerted on the piece, causing it to break off at the V-shaped notch, thus forming the freely accessible end surface of the waveguide as a fracture surface. An optical fiber is inserted into the V-shaped groove and extended up to the freely accessible end surface.
A method for fabricating a silicon semiconductor substrate having an integrated waveguide and an optical fiber coupled thereto, comprising the steps of:
Dependencies are inferred from the claim text.