Multi resonance unibody ultrasonic transducer
AssigneeKulicke & Soffa Investments, Inc.
InventorAli Reza Safabakhsh
Life of this patent
Estimating the term…
Abstract
A multi-resonance frequency ultrasonic transducer has a plurality of useful resonance frequencies for wire bonding operation and comprises an integral unibody with a rectangular aperture in the center of its mass. A multi-frequency stack of transducer drivers is mounted in the rectangular aperture with compression wedges. The length L of the stack of transducer drivers is equal to or less than one-quarter of one wavelength of the lower useful resonance frequency and the design envelopes for the useful frequencies embrace two or more useful fixed frequencies separated from spurious unusable frequencies by a minimum of two kilohertz.
Claims12
The method of making fine wire interconnections, comprising the steps of:
- providing a multi-frequency ultrasonic transducer of the type having a plurality of resonance frequencies,
- providing a multi-frequency ultrasonic generator coupled to said ultrasonic transducer, and
- providing a controller for selecting one or more of the plurality of resonance frequencies produced by ultrasonic generator, and
- coupling different ones of said plurality of resonance frequencies to said multi-frequency ultrasonic transducer during a wire bonding operation.
The method of making fine wire interconnections using an automatic wire bonder of the type employing a bonding tool mounted in an ultrasonic transducer, comprising the steps of:
- coupling a multi-frequency ultrasonic generator to said ultrasonic transducer,
- applying a bonding force through said bonding tool to a fine wire to be bonded to a target,
- coupling a plurality of resonance frequency outputs from said multi-frequency ultrasonic generator to said ultrasonic transducer during a wire bonding operation, and
- applying a plurality of different frequencies to said ultrasonic transducer while engaging said fine wire against said target.
The method of making fine wire bonds on semiconductor devices to optimize the strength of the first and second wire bonds comprising the steps of:
- making a plurality of first and second wire bonds at different frequencies,
- selecting the frequencies used at first and second wire bonds which result in the strongest wire bonds,
- programming the selected frequencies for first wire bonds into a wire bonding machine,
- programming the selected frequencies for second wire bonds into the wire bonding machine, and
- automatically making fine wire interconnection at first and second wire bond at the selected frequencies while coupling the selected frequencies to a multi-frequency responsive transducer.
Dependencies are inferred from the claim text.