US 5,699,610 AGranted

Process for connecting electronic devices

AssigneeNEC Corporation

InventorsYuzo Shimada, Takayuki Suyama, Yoshimasa Tanaka, Shinichi Hasegawa

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Abstract

In a first step, a first substrate is prepared. The first substrate has a first surface, a second surface, and a through-hole therebetween. In a second step, a second substrate is prepared. The second substrate has a first surface, a second surface, and a pad on the first surface of the second substrate. In a third step, a solder is provided on the pad of the second substrate. In a fourth step, the through-hole of the first substrate is positioned on the solder. The second surface of the first substrate and the first surface of the second substrate face each other. In a fifth step, the solder is heated to flow the solder into the through-hole of the first substrate. In the sixth step, an appearance of the solder on the first surface of the first substrate may be confirmed for detection of a connection of the solder.

Claims14

Dependent claims

A process for connecting electronic devices, comprising steps of:

(a) preparing a first substrate having a first surface, a second surface, and a through-hole therebetween;
(b) preparing a second substrate having a first surface, a second surface, and a pad on said first surface of said second substrate;
(c) providing a solder on said pad of said second substrate;
(d) positioning said through-hole of said first substrate on said solder, said second surface of said first substrate and said first surface of said second substrate opposing one another;
(e) heating said solder to flow said solder into said through-hole of said first substrate and to protrude said solder from said through-hole of said first substrate, to couple said first substrate to said second substrate;
and
(f) confirming one of an appearance of said solder on said first surface of said first substrate and whether at least a portion of said solder is protruding from said through-hole of said first substrate, thereby to judge a connection condition of said second surface of said first substrate to said first surface of said second substrate.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application: 08/474,019Filed 7 Jun 1995 · continuation in part
Priority: JP 6-08354822 Apr 1994
Granted: 23 Dec 1997
Term ends: Not estimatedThe source records don’t support an estimate.

Classification26 codes

H10W 70/095
Of insulating or insulated package substrates, or of interposers, or of redistribution layers: of vias therein
H05K 3/301
Assembling printed circuits with electric components, e.g. with resistors: by means of a mounting structure
H05K 3/363
Assembling flexible printed circuits with other printed circuits: by soldering
H10W 40/611
Securing means for detachable heating or cooling arrangements, e.g. clamps: bolts or screws

Family

Serial423,455Parent of this continuation-in-part · filed 19 Apr 1995
US 5,699,610 AThis patent

From the US filing history. Foreign family members aren’t listed.

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