US 5,699,597 AGranted

Method of manufacturing a tantalum solid state electrolytic capacitor

AssigneeRohm Co., Ltd.

InventorsShinji Nakamura, Chojiro Kuriyama

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Abstract

The use of a wire of a metal other than tantalum as a lead wire fixed to a chip formed by sintering tantalum powder is enabled. Prior to the formation of a dielectric film on a chip through anodic oxidation, an insulating material is applied to a surface of the lead wire fixed to the chip at a connection with the chip. With the application of the insulating material, a short circuit between the lead wire and a chemical conversion solution is prevented when the entire chip is drenched in the chemical conversion solution in anodic oxidation, so that a dielectric film of tantalum pentoxide is surely formed on the chip. As the lead wire, an arbitrary metal having conductivity may be used.

Claims6

Dependent claims

A capacitor device manufacturing method comprising the steps of:

preparing a tantalum sintered body having a copper or aluminum lead wire on one end surface thereof;
applying an insulating material to a surface of a root portion of the lead wire adjacent to the tantalum sintered body;
drenching the tantalum sintered body and a part of the root portion of the lead wire, to which the insulating material is applied, in a chemical conversion solution;
causing anodic oxidation by applying a current between the lead wire and the chemical conversion solution to form a dielectric film on a surface of the tantalum sintered body;
forming a solid state electrolytic layer on a surface of the dielectric film;
and
forming a cathode electrode film on a surface of the solid state electrolytic layer.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application: 08/452,433Filed 26 May 1995
Priority: JP 6-11635130 May 1994
Granted: 23 Dec 1997
Term ends: Not estimatedThe source records don’t support an estimate.

Classification4 codes

H01G 9/15
Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their…
H01G 2/065
Specially adapted for mounting on a printed-circuit support: for surface mounting, e.g. chip capacitors
H01G 4/236
Terminals: leading through the housing, i.e. lead-through
H01G
Capacitors

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No related US applications are recorded in the indexed filing history.

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