Method and apparatus for performing chemical vapor deposition

A method for performing a chemical vapor deposition procedure to deposit an insulating layer over a surface of a silicon wafer having components for integrated circuit devices located thereon, the method comprising the steps of:

• forming a passivation layer over the surface of the silicon wafer and the components located thereon;
• forming a plurality of spaced apart conductor segments over a surface of the passivation layer;
• heating the silicon wafer in a heating chamber, so as to raise the temperature of the conductor segments higher than the temperature of the passivation layer;
• and
• transferring the silicon wafer from the heating chamber to a reaction chamber,
• performing a chemical vapor deposition on the silicon wafer in the reaction chamber, while the temperature of the conductor segments is higher than the temperature of the passivation layer, to form an insulating layer over surfaces of the conductor segments and over surfaces of the passivation layer between the conductor segments, such that the insulating layer is thicker over the passivation layer between the conductor segments than over the conductor segments.

A method for performing a chemical vapor deposition procedure to deposit an insulating layer over a surface of a silicon wafer having components for integrated circuit devices located thereon, the method comprising the steps of:

• forming a passivation layer over the surface of the silicon wafer and the components located thereon;
• forming a plurality of conductor segments over a surface of the passivation layer;
• heating the silicon wafer at a temperature of about 300.degree. to 400 .degree. C. and sustained for about 1 to 2 minutes, so as to raise the temperature of the conductor segments higher than the temperature of the passivation layer;
• and
• after said step of heating, performing a chemical vapor deposition on the silicon wafer, to form a substantially flat insulating layer over surfaces of both the conductor segments and the passivation layer.