Back to results
US 5,689,404 AGranted
Heat sink having air movement device positioned among tins and between heating elements
AssigneeFujitsu Limited
InventorTadashi Katsui
Life of this patent
Estimating the term…
Abstract
The heat sink of the present invention applicable to at least two heating elements including two integrated circuit packages includes a base member fixed to the integrated circuit packages and having a plurality of fins, and air cooling means provided at a substantially central position of the base member. This construction allows an improvement in reliability, a reduction in noise, and a reduction in power consumption.
Claims17
A heat sink for removing heat from at least two heating elements mounted on a printed wiring board, comprising:
- a base member having a lower surface and an upper surface, said lower surface being mounted on said first and second heating elements, said upper surface having a blowing region located between said first and second heating elements, and a plurality of upwardly projecting radiation fins formed on the upper surface except at said blowing region;
- and
- an air blower provided in said blowing region for circulating air through said radiation fins.
A heat generating and cooling device, comprising:
- two heating elements mounted on a printed circuit board with a spacing area therebetween;
- a base member having opposing lower and upper surfaces, the lower surface being secured to the two heating elements and having a spacing area facing the spacing area between the heating elements, the upper surface having a blowing region located to oppose at least a portion of the spacing area of the lower surface, the upper surface having upwardly projecting heat radiation fins formed thereon except at the blowing region;
- and
- an air blower positioned in the blowing region for moving air through the heat radiation fins.
1 more element
Dependencies are inferred from the claim text.