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US 5,689,279 AGranted
Integrated electro-optical package
AssigneeMotorola, Inc.
InventorsRonald J. Nelson, John W. Stafford
Life of this patent
Estimating the term…
Abstract
An integrated electro-optical package including a semiconductor chip with a large array of light emitting devices formed thereon and cooperating to generate a complete real image. The light emitting devices are positioned in rows and columns and connected to pads adjacent outer edges of the chip. A window frame substrate having a central opening therethrough coextensive with the real image generated by the chip and mounting pads, bump bonded to the pads on the chip. A plurality of driver circuits connected to the light emitting devices through terminals on the window frame substrate. A lens mounted to the substrate over the opening and on a side opposite the chip to magnify the real image and produce an easily viewable virtual image.
Claims17
A portable electronic device with visual display comprising:
- a portable electronic device having a data output terminal;
- and
- a miniature virtual image display having a viewing aperture, the display being operably attached to the receiver and including a semiconductor chip having a major surface with a plurality of light emitting devices formed on the major surface, each of the light emitting devices having first and second electrodes for activating the light emitting devices, the light emitting devices defining a plurality of pixels positioned in rows and columns and cooperating to generate a complete real image, when activated, at a central portion of the major surface, the semiconductor chip further having external connection/mounting pads adjacent outer edges thereof and outside of the central portion of the major surface with the first electrodes of the light emitting devices being connected to a first plurality of the external connection/mounting pads defining rows of pixels and the second electrodes of the light emitting devices being connected to a second plurality of the external connection/mounting pads defining columns of pixels;
- a window frame substrate having a major surface and defining a central optically transparent light passage therethrough substantially coextensive with the real image at the central portion of the major surface of the semiconductor chip, the window frame substrate further having a plurality of electrical conductors formed therein, each extending from a mounting pad adjacent an edge of the central passage to a connection pad on the major surface of the window frame substrate, the major surface of the semiconductor chip being mounted on the major surface of the window frame substrate with the first and second pluralities of external connection/mounting pads being in electrical contact with the mounting pads of the window frame substrate and real image at the central portion of the major surface of the semiconductor chip being axially aligned and coextensive with the central passage in the major surface of the window frame substrate;
- a plurality of driver and controller circuits having data input terminals connected to the data output terminal of the electronic device and further having control signal output terminals adapted to be connected to the first and second terminals of the light emitting devices for activating the light emitting devices to generate real images in accordance with data signals applied to the data input terminals;
- and
- a mounting board having first and second opposed major surfaces with first electrical connection pads on the first major surface, second electrical connection pads on the second major surface and electrical connections formed in the mounting board between the first and second electrical connection pads, the plurality of driver and controller circuits being mounted on the first side of the mounting board with the control signal output terminals electrically contacting the first electrical connection pads, the window frame substrate being mounted on the second major surface of the mounting board with the second electrical connection pads in electrical contact with the first and second pluralities of external connection/mounting pads;
- and
- optics mounted in the electronic device and axially aligned with the central passage in the window frame substrate for defining the aperture and providing a virtual image from the real image generated by the array of light emitting devices, the real image being easily viewable by an operator of the electronic device.
6 more elements
A method of fabricating an electro-optical package comprising the steps of:
- forming a plurality of light emitting devices on the major surface of a semiconductor chip, each of the light emitting devices having first and second electrodes for activating the light emitting devices, the light emitting devices defining a plurality of pixels positioned in rows and columns and cooperating to generate a complete real image, when activated, at a central portion of the major surface, the semiconductor chip further being formed with external connection/mounting pads adjacent outer edges thereof and outside of the central portion of the major surface with the first electrodes of the light emitting devices being connected to a first plurality of the external connection/mounting pads defining rows of pixels and the second electrodes of the light emitting devices being connected to a second plurality of the external connection/mounting pads defining columns of pixels;
- forming a window frame substrate having a major surface and defining a central optically transparent light passage therethrough substantially coextensive with the real image at the central portion of the major surface of the semiconductor chip, forming a plurality of electrical conductors in the window frame substrate, a plurality of mounting pads adjacent an edge of the central passage and a plurality of connection pads on the major surface of the window frame substrate with each electrical conductor connecting a connection pad to a mounting pad;
- mounting the major surface of the semiconductor chip on the major surface of the window frame substrate with the first and second pluralities of external connection/mounting pads of the semiconductor chip being in electrical contact with the mounting pads of the window frame substrate and the real image at the central portion of the major surface of the semiconductor chip being axially aligned with the central passage in the major surface of the window frame substrate;
- forming a plurality of driver and controller circuits having data input terminals and further having control signal output terminals adapted to be connected to the first and second terminals of the light emitting devices for activating the light emitting devices to generate real images in accordance with data signals applied to the data input terminals;
- forming a mounting board with first and second opposed major surfaces and forming first electrical connection pads on the first major surface, second electrical connection pads on the second major surface and electrical connections in the mounting board between the first and second electrical connection pads;
- mounting the plurality of driver and controller circuits on the first side of the mounting board with the control signal output terminals electrically contacting the first electrical connection pads;
- and
- mounting the window frame substrate on the second major surface of the mounting board with the second electrical connection pads in electrical contact with the first and second pluralities of external connection/mounting pads.
5 more elements
Dependencies are inferred from the claim text.