Method for transfer molding standard electronic packages and apparatus formed thereby
AssigneeHestia Technologies, Inc.
InventorPatrick O. Weber
Life of this patent
Estimating the term…
Abstract
A method for transfer molding a standard electronic package and an apparatus resulting from such method. A seal is formed between a portion of the mold platens of the mold and a portion of a printed circuit board adjacent to electrical contacts along at least one side of the printed circuit board. After the apparatus is removed from the mold, a protective cap is placed over the electrical contacts.
Claims21
A method for transfer molding a standard electronic package, comprising the steps of:
- providing a substrate having an electronic component on a surface of the substrate and a plurality of electrical contacts along a side of the substrate, each of the electrical contacts having an attachment portion connected to the electronic component by metallized paths;
- providing mold platens that form a mold cavity;
- placing the substrate in the mold cavity between the mold platens such that the electrical contacts are located outside of the mold cavity, the mold platens forming a seal with the substrate adjacent to the plurality of electrical contacts such that the electrical contacts extend beyond the mold cavity formed by the mold platens;
- and
- encapsulating the standard electronic package by transferring fluid molding compound into the mold cavity to encapsulate the electronic component, and at least a part of the metallized paths and the substrate.
A transfer-molded standard electronic package, comprising:
- a substrate having an electronic component on a surface of the substrate and a plurality of electrical contacts along a side of the substrate, each of the electrical contacts having an attachment portion connected to the electronic component by metallized paths;
- and
- a transfer-molded encapsulant covering the substrate, the electronic component, and at least a part of the metallized paths such that the electrical contacts and at least a part of each of the attachment portions extend beyond the surface of the encapsulant and the encapsulant forms a seal with the substrate and the attachment portion of the electrical contacts.
A transfer-molded standard electronic package, comprising:
- a substrate having an electronic component on a surface of the substrate and a plurality of electrical contacts along a side of the substrate, each of the electrical contacts having an attachment portion connected to the electronic component by metallized paths;
- and
- a transfer-molded encapsulant covering the substrate, the electronic component, and at least a part of the metallized paths such that the electrical contacts and at least a part of the metallized paths protrude beyond the encapsulant and the encapsulant forms a seal with the substrate and at least a part of the metallized paths.
A transfer-molded standard electronic package, comprising:
- a substrate having an electronic component on a surface of the substrate and a plurality of electrical contacts along a side of the substrate, each of the electrical contacts having a sealing portion and an attachment portion connected to the electronic component by metallized paths;
- and
- a transfer-molded encapsulant covering the substrate, the electronic component, and at least a part of the metallized paths such that the electrical contacts and at least a part of the sealing portion of each of the electrical contacts protrude beyond the encapsulant and the encapsulant forms a seal with the substrate and the sealing portion of each of the electrical contacts.
Dependencies are inferred from the claim text.