Optical device assembly having a metallic bump bonding together two planar optical components, and its preparation
AssigneeSanta Barbara Research Center
InventorMichael J. Dahlin
Life of this patent
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Abstract
An optical device assembly includes a planar optical filter and a planar sensor having an optically active area. The optical filter and the sensor are joined together with a gap therebetween by a metallic bump extending between the optical filter and the sensor. The metallic bump, which is preferably indium, is positioned at a location outside of the optically active area of the planar sensor. The metallic bump is preferably formed by vapor depositing an indium subbump on the optical filter and another indium subbump on the planar sensor, in each case outside of their optically active areas, and thereafter pressing the two subbumps together to complete the bonding.
Claims19
An optical device assembly, comprising:
- a planar optical filter having a first face;
- a planar sensor having a second face and an optically active area;
- means for joining the optical filter to the sensor with a gap therebetween, the means for joining comprising
- a cold-weldable metallic bump extending between the first face of the optical filter and the second face of the sensor,
- a first bond between the metallic bump and the first face of the optical filter, and
- a second bond between the metallic bump and the second face of the sensor, the second bond being at a location outside of the optically active area of the planar sensor.
An optical device assembly, comprising:
- a planar first optical component;
- a planar second optical component having an optically active area, the first optical component being positioned in a facing relationship to the second optical component with a gap therebetween;
- and
- a cold-weldable metallic bump extending between the first optical component and the second optical component and bonding the first optical component and the second optical component together, the metallic bump contacting the second optical component at a location outside of its optically active area.
A method for preparing an optical device assembly, comprising the steps of:
- furnishing a planar first optical component having a first optically active area;
- furnishing a planar second optical component having a second optically active area;
- depositing a first subbump on the first optical component outside of the first optically active area;
- depositing a second subbump on the second optical component outside of the second optically active area;
- arranging the two optical components in a generally facing relationship with the first subbump and the second subbump aligned and in a facing relationship;
- and
- pressing the first optical component toward the second optical component to cause the first subbump and the second subbump to weld together, forming a bump therebetween.
Dependencies are inferred from the claim text.