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US 5,688,441 AGranted
Thixotropic conductive paste
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsMinehiro Itagaki, Yoshihiro Bessho, Satoru Yuhaku, Yasuhiko Hakotani, Kazuhiro Miura, Kazuyuki Okano
Life of this patent
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Abstract
A conductive paste includes inorganic material powders containing conductive powders and glass powders, an organic vehicle containing an organic binder and an organic solvent, and a metal organic compound.
Claims7
An electrically conductive paste, comprising:
- inorganic material powders containing an inorganic component comprising electrically conductive material powders and glass powders, wherein the electrically conductive material powders are selected from the group consisting of gold, copper, nickel, ruthenium, platinum, molybdenum, tungsten, and alloys and oxides thereof;
- an organic vehicle containing an electrically conductive paste resin and an organic solvent, wherein the electrically conductive paste resin contains at least one organic resin selected from the group consisting of polyvinyl butyral resin, polyvinyl alcohol resin, butyral resin, acrylic resin and phenol resin;
- and
- 0. 5 to 5.0% of the entire paste composition by weight of a compound selected from the group consisting of a) a metal organic complex containing an alcohol or an aldehyde, and b) an organic complex of silicon or boron.
1 more element
An electrically conductive paste for a ceramic wiring substrate, comprising:
- 75.0 to 90.5% of the entire paste composition by weight of an inorganic component comprising electrically conductive material powders and glass powders, wherein the electrically conductive material powders are selected from the group consisting of gold, copper, nickel, ruthenium, platinum, molybdenum, tungsten, and alloys and oxides thereof;
- 9.0 to 20.0% of the entire paste composition by weight of an organic vehicle component containing at least an electrically conductive paste resin and a solvent, wherein the electrically conductive paste resin contains at least one organic resin selected from the group consisting of polyvinyl butyral resin, polyvinyl alcohol resin, butyral resin, acrylic resin and phenol resin;
- and
- 0.5 to 5.0% of the entire paste composition by weight of a compound selected from the group consisting of a) a metal organic complex containing an alcohol for an aldehyde, and b) an organic complex of silicon or boron.
1 more element
Dependencies are inferred from the claim text.