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US 5,687,470 AGranted
Method for forming an RF shielded enclosure
AssigneeNokia Mobile Phones Ltd.
InventorsMikko Veijo Tapani Halttunen, Markku Gunnar Kankaanpaa
Life of this patent
Estimating the term…
Abstract
A method of providing a cover on a substrate to shield against radio frequency radiation, wherein an electrically conductive material--such as a conductive, possibly adhesive, paste--which shields against RF radiation is applied in a fluid state to the desired area of the substrate. The substrate may be a printed circuit board (1) or a base member of an RF housing.
Claims10
A method of connecting two members to each other to form an RF shielded enclosure comprising steps of:
- providing a first one of the two members with a plurality of recesses along an edge of a wall of the first member;
- applying an electrically conductive fluid at an area of a second one of the two members that is intended to mate with the edge of the first member's wall;
- and
- connecting the two members to each other with the electrically conductive fluid being sandwiched between the two members and extending, at least partially, into the recesses along the first member's wall.
1 more element
A method of connecting two members to each other to form an RF shielded enclosure comprising steps of:
- providing a first one of the two members with a plurality of recesses along an edge of a wall of the first member;
- applying an electrically conductive fluid along the edge of the wall;
- and
- connecting the two members to each other with the electrically conductive fluid being sandwiched between the two members and extending, at least partially, into the recesses along the first member's wall.
1 more element
Dependencies are inferred from the claim text.