Film carrier tape for use in tape automated bonding
AssigneeNEC Corporation
InventorMichitaka Urushima
Life of this patent
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Abstract
A film carrier tape for use in TAB, having a lead wiring of a desired shape, and formed on a base film having a sprocket hole for conveyance and positioning, for connecting electrode pads of a semiconductor chip, includes a corner slit formed in at least one portion of four corner portions of a suspender positioned between a device hole and outer lead holes so as to vertically communicate.
Claims7
A film carrier tape for use in Tape Automated Bonding (TAB), said film carrier tape comprising a base film having a device hole and outer lead holes, a suspender defined between said device hole and said outer lead holes, and sprocket holes for connecting electrode pads of a semiconductor chip to be placed at said device hole;
- and a lead wiring of a desired shape formed on said base film, a corner slit being formed in at least one of four corner portions of said suspender so as to enable vertical communication between said lead wiring and said semiconductor chip, wherein:
- said lead wiring extends from the device hole to each of the outer lead holes and is formed in a range of at least 1/3 a width of said suspender so that a distance between the device hole and an outer lead hole is at the same pitch as that of said electrode pads of said semiconductor chip, and the corner slit has a heartlike shape to enlarge the corner slit from a side of a sprocket hole toward a side of the device hole.
Dependencies are inferred from the claim text.