Positive-working photosensitive composition

Abstract

A positive working photosensitive composition is disclosed, which comprises: (a) a resin which is insoluble in water but soluble in an alkaline aqueous solution; (b) a compound which generates an acid upon irradiation with active light or radiation; (c) a low molecular acid-decomposable dissolution-inhibitive compound having a molecular weight of 3,000 or less and containing a group decomposable with an acid, and which increases its solubility in an alkaline developer by the action of an acid; and (d) a resin containing a basic nitrogen atom and having a weight-average molecular weight of 2,000 or more. A further positive working photosensitive composition is disclosed, which comprises: (1) a compound which generates an acid upon irradiation with active light or radiation; (2) a resin having a group which undergoes decomposition by an acid whereby increasing its solubility in an alkaline developer; and (3) a resin containing a basic nitrogen atom and having a weight-average molecular weight of 2,000 or more. The positive-working photosensitive composition of the present invention can easily and properly inhibit acid diffusion and acid deactivation on the surface thereof with time between the exposure and the heat treatment, keep the dissolution inhibiting effect exerted by the dissolution-inhibitive compound and exhibit a good profile, a high sensitivity and a high resolving power.

Dependencies are inferred from the claim text.