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US 5,683,262 AGranted
IC socket
AssigneeYamaichi Electronics Co., Ltd.
InventorsNoriyuki Matsuoka, Kazumi Uratsuji
Life of this patent
Estimating the term…
Abstract
In an IC socket, a depressing portion of a cover is pressed against a pressure receiving portion of a pressure receiving lever by downwardly pressing the cover, and then a contact portion of a contact is displaced in the rearward direction by movement of the pressure receiving lever. The depressing portion is formed by an inclined cam surface having a downward gradient in the rearward direction. When the cover is moved in the downward direction, the pressure receiving portion is caused to slidably move from the upper end side to the lower end side of the downwardly inclined cam surface.
Claims20
An IC socket for receiving an IC package having IC leads, said IC socket comprising:
- a socket body having an IC receiving portion at a central portion thereof;
- at least one row of parallel contacts mounted to said socket body outwardly of said IC receiving portion, each of said contacts having an IC lead contacting portion movable between an IC lead contacting position and an IC lead releasing position located outwardly of said IC lead contacting position;
- at least one pressure receiving lever respectively coupled with said contacts of said at least one row of parallel contacts, said at least one pressure receiving lever having a pressure receiving portion and being shiftable between an inward position and an outward position;
- a cover movably mounted on said socket body for movement between an upper position and a lower position, said cover including at least one downwardly extending sidewall having an inclined cam surface disposed outwardly of said IC receiving portion of said socket body and being respectively engageable with said at least one pressure receiving portion of said at least one pressure receiving lever for shifting said at least one pressure receiving lever toward said outward position upon movement of said cover toward said lower position to cause said contacts of said at least one row of parallel contacts to move toward said IC lead releasing positions;
- wherein said at least one inclined cam surface of said cover is inclined downwardly in a direction outwardly from said IC receiving portion of said socket body;
- and
- wherein said at least one inclined cam surface of said cover is curved, and inclined downwardly, over an entire length thereof from an innermost edge thereof to an outermost edge thereof, to thereby reduce a quantity of lowering of said cover necessary to adequately displace said contacts.
4 more elements
An IC socket for receiving an IC package having IC leads, said IC socket comprising:
- a socket body having an IC receiving portion at a central portion thereof;
- at least one row of parallel contacts mounted to said socket body outwardly of said IC receiving portion, each of said contacts having an IC lead contacting portion movable between an IC lead contacting position and an IC lead releasing position located outwardly of said IC lead contacting position;
- at least one pressure receiving lever respectively coupled with said contacts of said at least one row of parallel contacts, said at least one pressure receiving lever having a pressure receiving portion and being shiftable between an inward position and an outward position;
- a cover movably mounted on said socket body for movement between an upper position and a lower position, said cover including at least one downwardly extending sidewall having an inclined cam surface disposed outwardly of said IC receiving portion of said socket body and being respectively engageable with said at least one pressure receiving portion of said at least one pressure receiving lever for shifting said at least one pressure receiving lever toward said outward position upon movement of said cover toward said lower position to cause said contacts of said at least one row of parallel contacts to move toward said IC lead releasing positions;
- and
- wherein said at least one inclined cam surface of said cover is inclined downwardly in a direction outwardly from said IC receiving portion of said socket body;
- and
- wherein said at least one inclined cam surface of said cover is planar over an entire length thereof from an innermost edge thereof to an outermost edge thereof, to thereby reduce a quantity of lowering of said cover necessary to adequately displace said contacts.
5 more elements
An IC socket for receiving an IC package having IC leads, said IC socket comprising:
- a socket body having an IC receiving portion at a central portion thereof;
- at least one row of parallel contacts mounted to said socket body outwardly of said IC receiving portion, each of said contacts having an IC lead contacting portion movable between an IC lead contacting position and an IC lead releasing position located outwardly of said IC lead contacting position;
- at least one pressure receiving lever respectively coupled with said contacts of said at least one row of parallel contacts, said at least one pressure receiving lever having a pressure receiving portion and being shiftable between an inward position and an outward position;
- a cover movably mounted on said socket body for movement between an upper position and a lower position, said cover including at least one downwardly extending sidewall having an inclined cam surface disposed outwardly of said IC receiving portion of said socket body and being respectively engageable with said at least one pressure receiving portion of said at least one pressure receiving lever for shifting said at least one pressure receiving lever toward said outward position upon movement or said cover toward said lower position to cause said contacts of said at least one row of parallel contacts to move toward said IC lead releasing positions;
- and
- wherein said at least one inclined cam surface of said cover is inclined downwardly in a direction outwardly from said IC receiving portion of said socket body;
- and
- wherein said at least one inclined cam surface of said cover includes an inner portion which is planar and inclined downwardly in the direction outwardly from said IC receiving portion of said socket body, and an outer portion which is curved and inclined downwardly in the direction outwardly from said IC receiving portion, to thereby reduce a quantity of lowering of said cover necessary to adequately displace said contacts.
5 more elements
Dependencies are inferred from the claim text.