Integral thru-hole contacts
AssigneeMethode Electronics, Inc.
InventorWilliam E. Werther
Life of this patent
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Abstract
An integral thru-hole contact is provided for solderless connection of a pin inserted therein. The integral contact provides for an interconnect board of extremely low profile for interconnection with an IC package or sockets or pin grid array sockets and may provide for power/ground decoupling or voltage conversion and upgrading of microprocessors.
Claims11
An electrical connector comprising:
- an interconnect board having an array of thru-holes, the interconnect board including a first non-plated thru-hole having a ground plane forming a first integral contact protruding from and generally perpendicular to a first side of said first thru-hole and a power plane separated from said ground plane by a dielectric layer, the power plane forming a second integral contact protruding from and generally perpendicular to a second non-plated thru-hole wherein upon insertion of pins in the first and second thru-holes, the first and second contacts will flex and provide a compression fit to the contact pin.
An interconnect board comprising a ground plane, a power plane separated from the ground plane by a dielectric layer and an array of thru-holes located in said interconnect board, said at least one non-plated thru-hole having a contact integrally formed with the ground plane and mounted and generally perpendicular to said non-plated thru-hole wherein a solderless electrical interconnect is achieved.
Dependencies are inferred from the claim text.