Pressure-bonding unit and pressure-bonding head unit
AssigneeSony Corporation
InventorsNorio Kawatani, Hirokazu Nakayama
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AssigneeSony Corporation
InventorsNorio Kawatani, Hirokazu Nakayama
Estimating the term…
A thermocompression-bonding unit and a pressure-bonding head unit which are structurally simple and where reliability is high. The pressure-bonding head unit includes a pressure-bonding head; pressure-bonding head holding means for integrally fixing and holding the pressure-bonding head, the pressure-bonding head holding means being formed with a cutout from a first direction side in parallel with the pressure-bonding surface and also being formed with an opening perpendicular both to the first direction and the pressure-bonding surface; first deformation means for deforming the pressure-bonding head holding means so that a cutout inlet of the cutout opens or closes by a desired amount; and second deformation means for deforming the pressure-bonding head holding means so that one opening end or the other opening end of the opening is crushed in a direction parallel to the first direction by a desired amount. Thus the pressure-bonding unit and the pressure-bonding head unit, which are structurally simple and where reliability is high, can be realized.
A pressure-bonding unit, where a pressure-bonding surface of a head is contacted with pressure to a predetermined portion of a second object temporarily fixed to a first object and where said second object is pressed to said first object so that said second object is bonded to the first object with pressure, comprising:
A pressure-bonding head unit comprising:
Dependencies are inferred from the claim text.