Pattern alignment mark of semiconductor device
AssigneeHyundai Electronics Industries Co., Ltd.
InventorsSang Man Bae, Byoung Il Choi
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Abstract
A pattern alignment mark equipped with at least one designated measuring pattern for an alignment during the process of fabrication of semiconductor devices, a means for attenuating light reflection on the pattern with higher light reflection intensity among said designated measuring patterns, said attenuating means preventing the occurrence of a pattern alignment error due to the differences in the light reflection intensities while measuring the overlay accuracy of patterns, thus enhancing the yield and reliability of fabrication by achieving the stabilization of the process and the reduction of the process time.
Claims12
A pattern alignment mark formed on a substrate to form a semiconductor device, comprising:
- a plurality of designated measuring patterns for measuring overlay accuracy of layers, at least one of said designated measuring patterns having greater reflected light intensity along an x-axis direction relative to a y-axis direction;
- a light reflection attenuating means formed on said at least one of said designated measuring patterns for decreasing light reflected along the x-axis direction relative to the y-axis direction;
- and
- thereby reducing any difference in intensity along the x and y axes directions and improving accuracy in measuring distance between adjacent patterns.
Dependencies are inferred from the claim text.