Low-loss, low-inductance interconnect for microcircuits
AssigneeSun Microsystems, Inc.
InventorsRaghunand Bhagwan, Alan Rogers, John MacDonald
Life of this patent
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Abstract
A low-loss, low-inductance metal interconnect for an electrical signal in a microcircuit comprises a plurality of spaced-apart generally parallel metal interconnect lines disposed in a plane over an insulating layer. The metal interconnect lines are interleaved with and electrically insulated from a plurality of spaced-apart generally parallel metal lines disposed in the plane. The metal interconnect lines together comprise a signal interconnect path, and the metal lines are coupled to a fixed voltage potential, such as ground.
Claims4
A metal interconnect for an electrical signal comprising a plurality of spaced-apart generally parallel metal interconnect lines disposed in a plane over an insulating layer and electrically connected together, said metal interconnect lines interleaved with and electrically insulated from a plurality of spaced-apart generally parallel metal lines disposed in said plane, wherein ones of said metal lines are the outermost lines, said metal interconnect lines together comprising a single signal interconnect path, said metal lines comprising a low impedance signal return path coupled to a fixed voltage potential.
A metal interconnect for an electrical signal comprising:
- a plurality of spaced-apart generally parallel metal interconnect lines disposed in a plane over an insulating layer and electrically connected together;
- a plurality of spaced-apart generally parallel metal lines disposed in said plane and interleaved with and electrically insulated from said metal interconnect lines said metal lines coupled to a fixed voltage potential, wherein ones of said metal lines are the outermost lines;
- wherein said metal interconnect lines together comprise a single signal interconnect path for signals having a bandwidth exceeding about 1 GHz.
A metal interconnect for an electrical signal comprising a plurality of spaced-apart generally parallel metal interconnect lines disposed in a plane over an insulating layer and electrically connected together, said metal interconnect lines interleaved with and electrically insulated from a plurality of spaced-apart generally parallel metal lines disposed in said plane, wherein ones of said metal lines are the outermost lines, said metal interconnect lines together comprising a single signal interconnect path and having a cumulative width w, wherein w>>.delta., wherein .delta. is the skin depth, said metal lines coupled to a fixed voltage potential.
A method for providing a metal interconnect for an electrical signal comprising the steps of:
- providing a plurality of spaced-apart generally parallel metal interconnect lines disposed in a plane over an insulating layer;
- providing a plurality of spaced-apart generally parallel metal lines disposed in said plane interleaved with and electrically insulated from said metal interconnect lines, wherein ones of said metal lines are the outermost lines;
- connecting said metal interconnect lines together to a single signal source;
- and
- connecting said metal lines to a fixed voltage potential.
Dependencies are inferred from the claim text.