No-bond integrated circuit inputs
AssigneeCypress Semiconductor Corporation
InventorDavid Robert Lindley
Life of this patent
Estimating the term…
Abstract
A method and means for use when doing multiple products on an IC die and it becomes necessary to no-bond a control or address input thus requiring the connection of this IC input to a voltage of the proper polarity. In such a situation, an unused input pad is selectively bonded to a supply leadframe finger and connected to suitable logic to pull the unconnected IC input to the proper voltage. An embodiment whereby problems with noisy input voltages can be readily overcome is also described.
Claims15
In an integrated circuit having a supply pad, a no-connect (NC) input pad, and an integrated circuit (IC) input pad, in combination with IC logic and an input leadframe finger and a supply voltage leadframe finger, which is coupled to one of two supply voltages of opposite polarity and said supply pad, wherein said IC input pad is to be no-bonded, the connections comprising:
- said NC input pad is coupled to a common connection to the drain of a leaker transistor and the gate of a strong transistor in said IC logic, said leaker and strong transistors having their sources coupled to the other of said two voltages of opposite polarity from the one supply voltage coupled to said supply voltage leadframe finger;
- said IC input pad is coupled to the drain of said strong transistor;
- and
- bond wire means coupling said NC input pad to said supply voltage leadframe finger for pulling said IC input pad to the other of said two supply voltages from the one supply voltage coupled to said supply voltage leadframe finger.
A method for use when doing multiple products on an IC die where it is necessary to no-bond a control or address (IC) input, said die having a supply pad, a no-connect (NC) input pad, and an integrated circuit (IC) input pad, in combination with IC logic and an input leadframe finger and a supply voltage leadframe finger, which is coupled to one of two supply voltages of opposite polarity and said supply pad, comprising the steps of:
- coupling said NC input pad to a common connection to the drain of a leaker transistor and the base of a strong transistor in said IC logic, said leaker and strong transistors having their sources coupled to the other of two supply voltages of opposite polarity;
- coupling said IC input pad to the drain of said strong transistor;
- and
- coupling said NC input pad to said supply voltage leadframe finger to pull said IC input pad to the other of said two supply voltages from the one coupled to said supply voltage leadframe finger.
In an integrated circuit having a supply pad, a no-connect (NC) input pad, and an integrated circuit (IC) input pad, in combination with IC logic and an input leadframe finger and a supply voltage leadframe finger, which is coupled by a noisy supply voltage and said supply pad, the connections comprising:
- said NC input pad is coupled to a common connection to the drain of a leaker transistor and the input of an inverter, the output of said inverter being coupled to the gate of a strong transistor, said leaker and strong transistors and said inverter being in said IC logic;
- said IC input pad is coupled to the drain of said strong transistor, the source of said strong transistor being coupled to a quiet voltage of the same polarity as said noisy supply voltage;
- and
- bond wire means coupling said NC input pad to said noisy supply voltage leadframe finger for pulling said IC input pad to said quiet voltage.
Dependencies are inferred from the claim text.