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US 5,673,177 AGranted
Heat sink structure with corrugated wound wire heat conductive elements
AssigneeInternational Business Machines Corporation
InventorsWilliam Louis Brodsky, Glenn Lee Kehley, Sanjeev Balwant Sathe
Life of this patent
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Abstract
A heat sink structure with a heat-conducting base and wound wire heat conductors thermally attached to the base for use in electronic packaging structures, e.g., those used in computers. The method of making such a structure, as taught herein, provides a unique structure using wire to form the thermally conductive members in a corrugated shape and aligning these with and thermally coupling to a base structure. In one embodiment, the base structure may be excluded with a heat conductive spacer member used instead.
Claims61
A method of making a heat sink structure comprising the steps of:
- providing a heat-conducting base member having a plurality of lateral slots therein;
- forming a first substantially planar corrugated wound wire conductive element from a substantially singular wire;
- locating a substantially planar spacer member against said first wound wire heat conductive element;
- forming a second substantially planar corrugated wound wire heat conductive element from a substantially singular wire;
- positioning said second substantially planar corrugated wound wire heat conductive element against said substantially planar spacer member;
- and
- positioning both said first and second substantially planar corrugated wound wire heat conductive elements within said lateral slots within said heat-conducting base member in a thermally conductive manner.
4 more elements
A method of making a heat sink structure comprising the steps of:
- providing a heat-conducting base member;
- forming a first substantially planar corrugated wound wire heat conductive element from a substantially singular wire;
- locating a substantially planar spacer member against said first wound wire heat conductive element;
- forming a second substantially planar corrugated wound wire heat conductive element from a substantially singular wire;
- positioning said second substantially planar corrugated wound wire heat conductive element against said substantially planar spacer member;
- and
- positioning both of said first and second substantially planar corrugated wound wire heat conductive elements on said heat-conducting base member in a thermally conductive manner, said method further including providing a plurality of spacedly positioned rodlike members and thereafter winding said substantially planar corrugated heat conductive elements about said rodlike members prior to said positioning of said heat conductive elements on said heat-conducting base member.
4 more elements
A method of making a heat sink structure comprising steps of:
- providing a heat-conducting base member having a plurality of individual wire receiving means therein;
- forming a first substantially planar corrugated wound wire heat conductive element from a substantially singular wire;
- forming a second substantially planar corrugated wound wire heat conductive element from a substantially singular wire;
- and
- positioning said first and second substantially planar corrugated wound wire heat conductive elements within respective ones of said wire receiving means in said heat-conducting base member in a thermally conductive manner.
2 more elements
A method of making a heat sink structure comprising the steps of:
- providing a plurality of spacedly positioned rodlike members;
- forming a first substantially planar corrugated wound wire conductive element from a substantially singular wire;
- locating at least one substantially planar heat conductive spacer member against said first wound wire heat conductive element in a thermally conductive manner;
- forming a second substantially planar corrugated wound wire heat conductive element from a substantially singular wire, said first and second wire heat conductive elements being wound about said spacedly positioned rodlike members during said forming thereof;
- and
- positioning said second substantially planar corrugated wound wire heat conductive element against said substantially planar spacer member in a thermally conductive manner.
3 more elements
A heat sink structure comprising:
- a heat-conducting base member including a plurality of substantially parallel slots therein;
- a plurality of substantially planar corrugated wound wire heat conductive elements each formed from a substantially singular continuous wire;
- selected ones of said heat conductive elements being positioned in a side-by-side, substantially parallel, spaced-apart relationship so as to permit fluid flow through said elements in at least two different directions, said selected ones of said heat conductive elements including a series of curved end portions positioned within said slots within said base member in a thermally conductive manner.
A heat sink comprising:
- a plurality of spacedly positioned rodlike members;
- a plurality of substantially planar corrugated wound wire heat conductive elements each formed from a substantially singular continuous wire, said heat conductive elements being wound about said rodlike members and positioned in a side-by-side, substantially parallel, spaced-apart relationship so as to permit fluid flow through said elements in at least two different directions;
- at least one substantially planar thermally conductive spacer for providing said spacing between respective pairs of said heat conductive elements;
- selected ones of said wound wire heat conductive elements each including a series of curved end portions positioned against said substantially planar thermally conductive spacer in a thermally conductive manner.
1 more element
An electronic apparatus comprising:
- an electronic device having at least one substantially planar thermally conductive surface;
- and
- a heat sink structure including a substantially planar heat conducting base member including a plurality of substantially parallel, spaced apart elongated grooves therein oriented in a first direction and a plurality of substantially parallel and spaced apart corrugated wound wire heat conductive elements thermally joined to said substantially planar heat conducting base member and oriented in a second direction substantially perpendicular to said first direction, selected ones of said wound wire heat conductive elements including a plurality of curved ends, each of said ends positioned within a respective one of said elongated grooves of said heat conducting base member, said electronic device being joined to said heat conducting base member of said heat sink structure in a thermally conductive manner along said substantially planar thermally conductive surface of said electronic device.
An electronic apparatus comprising:
- an electronic device having at least one substantially planar thermally conductive surface;
- and
- a heat sink structure including a substantially planar heat conducting base member including a plurality of substantially parallel, spaced apart elongated grooves therein oriented in a first direction and a plurality of substantially parallel and spaced apart corrugated wound wire heat conductive elements and at least one heat conducting spacer member, said wound wire conductive elements thermally joined to said base member and said heat conducting spacer member and oriented in a second direction substantially perpendicular to said first direction, selected ones of said wound wire heat conductive elements including a plurality of curved ends, each of said ends positioned within a respective one of said elongated grooves of said heat conducting base member, said electronic device being joined to said wound wire heat conductive elements and said heat conducting spacer member in a thermally conductive manner along said electronic device.
Dependencies are inferred from the claim text.