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AssigneeDell USA, L.P.
InventorsMark B. Penniman, Peter N. Skillman, Tony J. Lillios, Dennis J. Boyle
Estimating the term…
A thermal transfer circuit is provided for dissipating thermal energy within a portable minicomputer. The thermal transfer circuit is formed during assembly of the personal computer. Specifically, the thermal transfer circuit embodies dual cooling paths for extracting thermal energy from opposing surfaces of an encapsulated integrated circuit. The dual path thermal transfer circuit is formed by drawing the integrated circuit between an upper path heatsink assembly and a lower path heatsink assembly. Thermal connection of heatsink assemblies to corresponding integrated circuit surfaces, either directly or indirectly, allows enhanced dissipation of power-consumptive integrated circuits, such as modern day CPUs. Clamping of the upper and lower heatsink assemblies occurs in equal and opposite force directions normal to opposed integrated circuit surfaces. The normal clamping forces eliminate application of shear force components upon integrated circuit surfaces and the deleterious effects of surface mount lead dislodgment.
A system for cooling a heat source, comprising:
The system as recited in claim 7, wherein said heat source comprises an integrated circuit.
The system as recited in claim 7, wherein said heat source comprises an encapsulated microprocessor integrated circuit.
A system for cooling a heat source, comprising:
A system for cooling a heat source, comprising:
A system for cooling a heat source, comprising:
Dependencies are inferred from the claim text.