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US 5,672,915 AGranted
Ceramic coated plastic package
AssigneeTexas Instruments Incorporated
InventorsDonald C. Abbott, Raymond A. Frechette
Life of this patent
Estimating the term…
Abstract
The invention is to a semiconductor package and the method of making the package. A moisture resistant coating such as a ceramic material is applied over a plastic packaged semiconductor device to seal the package from moisture.
Claims6
A mixed composition package for a semiconductor device, comprising:
- a semiconductor device comprising a body and at least one lead extending from said body;
- a plastic layer surrounding the semiconductor body so as to fully encase said semiconductor body in a unitary, integrally formed seamless plastic package, said lead extending through said plastic package such that said plastic layer overlies a portion of said lead, whereas a remaining portion of said lead extends outside of said plastic package;
- and
- a jacket comprising a layer of a ceramic material which overlies said plastic package so as to completely encase said plastic package and a segment of said remaining lead portion extending beyond said plastic package.
1 more element
A mixed composition package for a semiconductor device, comprising:
- a semiconductor device comprising a body and a plurality of electrically conductive leads extending from said body;
- a seamless, unitary plastic layer overlying said semiconductor device body so as to fully encapsulate the body in plastic;
- and
- a jacket formed as a seamless unitary ceramic layer, said jacket defining a cavity within which is received said plastic encapsulated semiconductor body, whereby each of said plurality of leads is comprised of a first lead portion while extends from said semiconductor body through said plastic layer to said jacket, a second lead portion that extends from said first lead portion through said jacket, and a third lead portion that extends from said second lead portion and beyond said jacket.
1 more element
Dependencies are inferred from the claim text.