Magnesium composite electronic packages

A system comprising:

• an electronic component having a specific coefficient of thermal expansion;
• and
• a cast metal matrix composite having a coefficient of thermal expansion which essentially matches that of the element, said composite in contact with said electronic component such that heat can be transferred therebetween, said composite comprising reinforcement material filled with a cast matrix material having magnesium, said composite having a base and at least one wall that extends at an angle from the base, said cast matrix material forming a continuum between said base and said one wall.

An electronic package for holding an electronic component having a specific coefficient of thermal expansion comprising:

• a cast metal matrix composite having a coefficient of thermal expansion which essentially matches that of the element, said composite in contact with said electronic component such that heat can be transferred therebetween, said composite comprising reinforcement material filled with a cast matrix material having magnesium, said composite having a base upon which the electronic component is disposed and at least one wall that extends at an angle from the base, said cast matrix material forming a continuum between said base and said one wall.

An electronic package for holding an electronic component having a specific coefficient of thermal expansion comprising:

• a cast metal matrix composite having a coefficient of thermal expansion which essentially matches that of the element, said composite in contact with said electronic component such that heat can be transferred therebetween, said composite having a base upon which the electronic component is disposed, said composite comprising reinforcement particles filled with a cast matrix material having magnesium.

A system comprising:

• an electronic component having a specific coefficient of thermal expansion;
• and
• a cast metal matrix composite having a coefficient of thermal expansion which essentially matches that of the element, said composite in contact with said electronic component such that heat can be transferred therebetween, said composite comprising reinforcement particles filled with a cast matrix material having magnesium, said cast matrix forming a continuum throughout the composite.

A system comprising:

• an electronic component having a specific coefficient of thermal expansion;
• and
• a metal matrix composite having a coefficient of thermal expansion which essentially matches that of the element, said composite in contact with said electronic component such that heat can be transferred therebetween, said composite comprising a matrix material including magnesium having reinforcement particles therein, the reinforcement particles consisting essentially of a material selected from the group consisting of ceramics, graphite and diamond.

A system comprising:

• an electronic component having a specific coefficient of thermal expansion;
• and
• a metal matrix composite having a coefficient of thermal expansion which essentially matches that of the element, said composite in contact with said electronic component such that heat can be transferred therebetween, said composite comprising at least 50 volume percent reinforcement particles filled with a matrix material having magnesium.

A metal matrix composite comprising:

• a cast matrix comprising magnesium;
• and
• reinforcement particles distributed within the cast matrix.