Sputtering device
AssigneeFuji Xerox Co., Ltd.
InventorsTsutomu Hamada, Takehito Hikichi
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AssigneeFuji Xerox Co., Ltd.
InventorsTsutomu Hamada, Takehito Hikichi
Estimating the term…
A sputtering device for coating a substrate which enters the device downstream and exits the device upstream. The device includes a vacuum container having a gas exhausting portion; a gas providing portion for providing inactive gas and reactive gas into the vacuum container upstream of the gas exhausting portion; a target provided in the vacuum container between a gas inlet and the gas exhausting portion; a diffusion interval from the target to the gas inlet, the diffusion interval having a length at least as great as the shortest distance between the target and the substrate to be coated; substrate supporting structure for supporting the substrate so that the substrate faces the target; and a plasma producing portion to produce gas plasma near the substrate. The reactive gas uniformly diffuses with the inactive gas within the diffusion interval, is made to be a plasma state, and reacts with sputtering particles scattered from the target to form a uniform film on a surface of the substrate.
A sputtering device for coating a mobile substrate entering said device downstream and exiting upstream of said device, comprising:
A sputtering device for uniformly coating a surface of a mobile substrate which enters said device at a downstream position and exits said device at an upstream position, said device comprising:
A sputtering device for uniformly coating a surface of a mobile substrate which enters said device at a downstream end and exits said device at an upstream end, said device comprising:
Dependencies are inferred from the claim text.