Thin-film transistor array for display
AssigneeSony Corporation
InventorHiroyuki Ikeda
Life of this patent
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Abstract
A thin-film transistor array for display comprises a substrate and an interconnection layer, a plurality of pixel electrodes and thin-film transistors are integrally formed on the substrate, the interconnection layer is patterned so as to connect individual thin-film transistors, and at least part of the interconnection layer is laminated with a conductive layer and a metal layer having a smaller resistive value than the conductive layer being overlaid on the conductive layer in such a manner that the conductive layer is of a sufficient layer thickness to ensure the physical continuity of the thin-film pattern and the metal layer contributes to the lowering of the line surface resistance and is overlaid thinly enough to prevent the occurrence of surface variations such as hillocks.
Claims11
A thin-film transistor array for displaying comprising:
- a plurality of pixel electrodes and thin-film transistors integrally formed on a substrate;
- and
- an interconnection layer patterned for connecting individual thin-film transistors, wherein at least part of the interconnection layer is laminated with a conductive layer and a metal layer, wherein said metal layer has a lower resistance value than does said conductive layer and wherein said metal layer is overlaid on said conductive layer, and
- wherein the metal layer comprises a metal film 200 nm or less thick composed mainly of aluminum.
A thin-film transistor array for displaying comprising:
- a plurality of pixel electrodes and thin-film transistors integrally formed on a substrate;
- and
- an interconnection layer patterned for connecting individual thin-film transistors, wherein at least part of the interconnection layer is laminated with a conductive layer and a metal layer, wherein said metal layer has a lower resistance value than does said conductive layer and wherein said metal layer is overlaid on said conductive layer;
- and
- wherein the metal layer is a single metal film comprising a material selected from the group consisting of molybdenum, titanium, tungsten, chrome, nickel, tantalum and an alloy thereof, having a thickness of 300 nm or less.
A thin-film element array line for connecting thin-film elements integrally formed on an insulation substrate, comprising:
- a conductive layer having a layer thickness sufficient for ensuring physical continuity as a thin-line pattern;
- and
- a metal layer laminated on the conductive layer thinly enough to cause no surface variations in the thin line pattern, with a smaller resistance value and thickness than the conductive layer.
A liquid crystal display device comprising:
- a pair of opposing substrates interposed with a prescribed gap;
- a liquid crystal layer held in the gap;
- pixel electrodes and thin-film transistors integrally formed on one of the substrates;
- opposing electrodes formed on the other substrate;
- and
- an interconnection layer patterned for connecting individual thin-film transistors, wherein at least part of the interconnection layer is laminated with a conductive layer and a metal layer, wherein said metal layer has a lower resistance value than does said conductive layer and wherein said metal layer is overlaid on said conductive layer;
- and
- wherein the metal layer comprises a metal film 200 nm or less thick composed mainly of aluminum.
A liquid crystal display device comprising:
- a pair of opposing substrates interposed with a prescribed gap;
- a liquid crystal layer held in the gap;
- pixel electrodes and thin-film transistors integrally formed on one of the substrates;
- opposing electrodes formed on the other substrate;
- and
- an interconnection layer patterned for connecting individual thin-film transistors, wherein at least part of the interconnection layer is laminated with a conductive layer and a metal layer, wherein said metal layer has a lower resistance value than does said conductive layer and wherein said metal layer is overlaid on said conductive layer;
- and
- wherein the metal layer is a single metal film comprising a material selected from the group consisting of molybdenum, titanium, tungsten, chrome, nickel, tantalum and an alloy thereof, having a thickness of 300 nm or less.
Dependencies are inferred from the claim text.