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US 5,670,016 AGranted
Method for cleaning substrate prior to tungsten deposition
AssigneeNational Science Council
InventorsMao-Chieh Chen, Wen-Kuan Yeh, Pei-Jan Wang, Lu-Min Liu
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Abstract
A method for cleaning a substrate prior to tungsten deposition is disclosed, said substrate having via holes and trenches lines thereon. The method includes steps of providing a solution of hydroxylamine sulfate; dipping said substrate in said solution; and agitating said solution by an agitating device.
Claims20
A method for cleaning a substrate prior to a tungsten deposition, said substrate having via holes and trenches thereon, said method comprising steps of:
- providing a solution of hydroxylamine sulfate;
- and
- dipping said substrate in said solution and agitating said solution by an agitating means.
A method for fabricating semiconductor integrated circuits, said method comprising steps of:
- providing a semiconductor substrate having via holes and trenches thereon;
- and
- dipping said substrate in a solution of hydroxylamine sulfate and agitating said solution by an agitating means.
Dependencies are inferred from the claim text.