Semiconductor wafer pre-aligning apparatus
AssigneeSamsung Electronics Co., Ltd.
InventorChang-youl Moon
Life of this patent
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Abstract
A semiconductor wafer pre-aligning apparatus includes a wafer transfer unit for transferring a semiconductor wafer, and a wafer stopping unit for stopping and disposing the transferred semiconductor wafer on a predetermined position of a transferring path. The wafer stopping unit includes a stop elevatably disposed on the wafer transferring path and having a plurality of stepped and arc-shaped walls whose radii are different from one another but whose curvature centers coincide, and a device for elevating the wafer stopping unit. Thus, changes in wafer size can be dealt with easily and a clean work environment for wafer treatment can be maintained.
Claims4
A semiconductor wafer pre-aligning apparatus comprising:
- a wafer transfer unit for transferring a semiconductor wafer;
- and
- a wafer stopping unit for stopping and disposing said transferred semiconductor wafer on a predetermined position of a transferring path,
- wherein said wafer stopping unit comprises:
- a stop elevatably disposed on said wafer transferring path and having a plurality of stepped and arc-shaped walls whose radii are different from one another but whose curvature centers coincide;
- and
- means for elevating said wafer stopping unit.
Dependencies are inferred from the claim text.