Wafer transfer plate

A wafer transfer plate for use in a wafer manufacturing system, said wafer transfer plate comprising:

• a grip portion adapted to be gripped by a moving mechanism;
• and
• a wafer receiving portion comprising:
• a member having an inner end connected to said grip portion and an outer end,
• a generally planar upper surface disposed between said inner end and said outer end,
• a plurality of receptors raised with respect to said upper surface and adapted to contact a wafer and support said wafer spaced above said upper surface, and
• a coating covering at least those portions of said plurality of receptors that contact said wafer, said coating comprising a material that does not contain elements harmful to said wafer, wherein said coating comprises a hard carbon film comprising a material selected from a group consisting of diamond like carbon and a transparent hard carbon.

A wafer transfer unit for use in a wafer manufacturing system, said wafer transfer unit comprising:

• a plurality of wafer transfer plates each having a first end and a second end;
• and
• a chucking head for supporting each of said plurality of wafer transfer plates at said first end such that said plurality of wafer transfer plates are disposed in a stacked relationship with one another with a vertical space between each of said wafer transfer plates, wherein each said wafer transfer plates comprises:
• a generally planar upper surface disposed between said first end and said second end,
• a plurality of receptors raised with respect to said upper surface and adapted to contact a wafer and support said wafer spaced above said upper surface, and
• a coating covering at least those portions of said plurality of receptors that contact said wafer, said coating comprising a material that does not contain elements harmful to said wafer, wherein said coating comprises a hard carbon film comprising a material selected from a group consisting of diamond like carbon and a transparent hard carbon.