Loading patent…
AssigneeFuji Electric Co., Ltd.
InventorFumiaki Kirihata
Estimating the term…
A semiconductor device is manufactured by a jig. The jig includes a pair of flat heat spreading devices with flat heaters, and an enclosing device for surrounding an assembly of the semiconductor device situated between the heat spreading devices. An assembly of the semiconductor device includes a common electrode plate, semiconductor chips placed above the common electrode, metal contact terminal plates placed above the semiconductor chips, and solder sheets placed at least a portion between the semiconductor device and the common electrode and a portion between the semiconductor chip and the contact terminal plate. The assembly is held between the heat spreading devices, and a reducing gas is supplied to isolate the assembly from atmosphere. The heater plates attached to the heat spreading plates is heated to uniformly heat the solder sheets at a predetermined temperature, and the heater plates are pressed vertically at a predetermined temperature to bond the semiconductor chips to the common electrode plate or to the metal contact terminal plates under pressure. Thus, the heights of the metal contact terminal plates are aligned uniformly.
A jig for manufacturing a semiconductor device including a plurality of semiconductor chips, a common electrode plate for the semiconductor chips situated under the semiconductor chips, terminal plates situated on the semiconductor chips, and solder sheets for connecting the semiconductor chips to at least one of the common electrode plate and the terminal plates, said jig comprising:
A method of manufacturing a semiconductor device comprising:
A method for soldering semiconductor chips and electrode plates, comprising,
Dependencies are inferred from the claim text.