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US 5,669,513 AGranted
Wafer carriage
AssigneeSamsung Electronics Co., Ltd.
InventorsJae-young Oh, Suk-yong Jeong, Han-sung Kim, Jin-ho Park
Life of this patent
Estimating the term…
Abstract
A wafer carriage is disclosed. An edge of the wafer carriage is roundly formed so that an edge of the wafer when colliding against the wafer can be prevented from chipping, pads are provided to a guide on the upper side of the wafer carriage so that the wafer when moving can be prevented from sliding, and thus, the wafer chipping occurred in a successive process can be prevented.
Claims10
A wafer carriage having:
- a main surface, the outer dimensions of which define a border;
- a guide that protrudes from said main surface along portions of said border;
- and
- an entrance provided along a remaining portion of said border through which a wafer is loaded on said wafer carriage, said main surface adjacent said entrance having edges against which said wafer collides when being loaded on said wafer carriage, said edges being rounded.
1 more element
A wafer carriage having:
- a main surface, the outer dimensions of which define a border;
- a guide protruding from said main surface along portions of said border;
- and
- a plurality of pads arranged on an inner region of said main surface of said wafer carriage.
1 more element
Dependencies are inferred from the claim text.