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AssigneeInternational Business Machines Corporation
InventorsNageshwer Rao Bantu, William Ross Brunsvold, George Joseph Hefferon, Wu-Song Huang, Ahmad D. Katnani, Mahmoud M. Khojasteh, Ratnam Sooriyakumaran, Dominic Changwon Yang
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Proton sponge, berberine, and cetyltrimethyl ammonium hydroxide base compounds are used as additives to chemically amplified photoresists based on modified polyhydroxystyrene (PHS). The base additives scavenge free acids from the photoresist in order to preserve the acid labile moieties on the modified PHS polymer. The base additives are well suited to industrial processing conditions, do not react with the photoacid compounds in the photoresist composition to form byproducts which would hinder photoresist performance, and extend the shelf-life of the photoresist composition. In addition, the proton sponge and berberine base additives have a different absorption spectra than the modified PHS polymer, therefore, the quantity of base additive within the photoresist can be easily assayed and controlled.
A method for improving chemically amplified photoresists, comprising the step of adding a base selected from the group consisting of berberine and proton sponge to a chemically amplified photoresist composition.
A method for improving chemically amplified photoresists, comprising the step of adding a base selected from the group consisting of berberine and proton sponge to a chemically amplified photoresist composition, wherein the resulting photoresist composition comprises:
Dependencies are inferred from the claim text.