Device separation structure and semiconductor device improved in wiring structure
AssigneeCanon Kabushiki Kaisha
InventorsKeiji Ishizuka, Yuzo Kataoka, Toshihiko Ichise, Hidekazu Takahashi, Hayao Ohzu
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Abstract
A semiconductor device has a device region, and a device separation region formed on a semiconductor substrate doped with impurities. And, the device separation region has a metal wiring formed on the surface of the device region or the back surface of the substrate. An aluminum region extending in the longitudinal direction connected to the metal wiring is formed within the device separation region.
Claims6
A method for producing a semiconductor integrated circuit device wherein plural semiconductor elements are found in a common semiconductor substrate of a first conductivity type and a separation region for separating said plural semiconductor elements, said method comprising the steps of:
- forming a separation region having a groove comprising a bottom section of a semiconductor of a second conductivity type opposite to the first conductivity type and a side wall of an insulator;
- forming a metal made of aluminum by selectively depositing aluminum within said groove by means of a CVD process using alkylaluminumhydride and burying said metal within said groove;
- forming a contact hole in an insulating film provided on one of said semiconductor elements;
- simultaneously deposting a conducting material in said contact hole and on said aluminum within said groove;
- and
- electrically connection said deposited conducting material in said contact hole and on said aluminum within said groove with a wiring layer.
Dependencies are inferred from the claim text.