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US 5,665,168 AGranted
Method for cleaning semiconductor silicon wafer
AssigneeShin-Etsu Handotai Co., Ltd.
InventorsMasami Nakano, Isao Uchiyama, Hiroyuki Takamatsu
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Abstract
A method for cleaning a semiconductor silicon wafer, which can suppress and reduce adhesion of particles to the surface of the wafer, is disclosed. The method includes the steps of cleaning the semiconductor silicon wafer by using hydrofluoric acid aqueous solution containing a surfactant, and thereafter rinsing the semiconductor silicon wafer by using pure water containing ozone.
Claims5
A method for cleaning a semiconductor silicon wafer comprising the steps of:
- cleaning the semiconductor silicon wafer by using hydrofluoric acid aqueous solution containing a surfactant and thereafter
- rinsing the semiconductor silicon wafer by using water containing ozone,
- wherein the concentration of the surfactant contained in the hydrofluoric acid aqueous solution is in the range 0.01%-5.00% by weight, and
- the concentration of the ozone contained in the water is not less than 0.5 ppm.
1 more element
Dependencies are inferred from the claim text.