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US 5,664,681 AGranted
Multiple device carrier
AssigneeMitsubishi Semiconductor America, Inc.
InventorNour Eddine Derouiche
Life of this patent
Estimating the term…
Abstract
A multiple device carrier is designed to hold ZIP or SIP packages tightly in its cells. The cells are spaced to provide air flow for cooling the packages and allowing heat generated within the packages to dissipate. The carrier is provided with a locking strip member to prevent loosening of the packages in the cells and allow leads of the packages to be aligned. The package assembly held by the carrier can be inserted into a socket to connect the circuit packages with external circuitry.
Claims12
An electronic package assembly comprising:
- a plurality of top longitudinal strips extending in parallel across a top surface of the assembly between opposite top transverse ribs thereof,
- a plurality of bottom longitudinal strips extending in parallel across a bottom surface of the assembly between opposite bottom transverse ribs thereof,
- a plurality of side strips extending across side surfaces of the structure between said top and bottom longitudinal strips,
- one of the top traverse ribs defining a holding strip inclined with respect to said top and side surfaces between said top longitudinal strips and said side strips, and
- a plurality of electronic packages insertable from said bottom surface of the assembly into openings defined by distances between said bottom longitudinal strips, the electronic packages having leads projecting through said openings beyond said bottom longitudinal strips, and having oblique cuts positioned along said holding strip.
2 more elements
An integrated circuit (IC) package assembly comprising:
- a plurality of cells provided side by side within said assembly,
- each of said cells including:
- a pair of parallel top longitudinal strips provided between opposite top transverse ribs of said assembly,
- a pair of parallel bottom longitudinal strips provided between opposite bottom transverse ribs of said assembly, and
- two pairs of side strips provided perpendicular to said top and bottom longitudinal strips and said top and bottom transverse ribs, and
- a a plurality of IC packages insertable from said bottom surface of the assembly into said plurality of cells through openings defined by distances between said bottom longitudinal strips, each of the IC packages having leads arranged along a bottom edge and projecting through said openings beyond said bottom longitudinal strips, and an oblique cut formed on a top front edge,
- one of the top traverse ribs defining a holding strip arranged between said top longitudinal strips and said side strips and inclined with respect to said top and side surfaces so as to accommodate an oblique cut on each of the IC packages.
4 more elements
Dependencies are inferred from the claim text.