Back to results
US 5,664,497 AGranted
Laser symbolization on copper heat slugs
AssigneeTexas Instruments Incorporated
InventorsEdgar R. Zuniga, Archie W. Sutton, Ray H. Purdom
Life of this patent
Estimating the term…
Abstract
The invention is to a method of placing symbolization on a heat spreader, used in conjunction with the semiconductor package, through the use of a low powered laser beam. The beam is scanned over the package surface at a preset intensity and for a desired time to change the surface texture of the heat spreader, and to change the reflectivity of the scanned area.
Claims7
A method of placing symbolization on semiconductor devices, comprising the steps of:
- coating an area to be symbolized with an oxide material;
- exposing a portion of the oxide material in a desired pattern with a low power Laser beam in the range of 75 kilowatts;
- and
- exposing the portion of the oxide material for a period sufficient to change a reflectivity of the portion of the oxide material without burning through the portion of the oxide material.
1 more element
A method for placing symbolization on a semiconductor device package, comprising the steps of:
- oxide coating a surface of the package;
- tracing a desired pattern on the oxide coating with a laser beam in the range of 75 kilowatts;
- and
- maintaining the beam on the oxide coating for a time sufficient to change a reflectivity of the oxide coating without burning through the oxide coating.
1 more element
Dependencies are inferred from the claim text.