Apparatus for testing a nonpackaged die

A fixture for making temporary electrical connections with an integrated circuit die to permit electrical testing of various parameters of the circuitry of the integrated circuit, the die having interconnect pads arranged in a predetermined pattern, comprising a substantially rigid support member having a surface, a layer of elastomeric material carried by the surface of the support member, a plate member carried by the layer of elastomeric material and spaced apart from the support member, the plate member having opposite first and second surfaces and provided with a plurality of bores extending through the first and second surfaces and forming a pattern on the second surface generally corresponding to the predetermined pattern of interconnect pads, a longitudinally extending contact element having first and second end portions slidably disposed in each of the plurality of bores, engagement means adapted for bringing the contact elements into registration and engagement with the interconnect pads to make nonpermanent temporary electrical connections therebetween, the engagement means including a package adapted to carry the die and having leads which permit making electrical connections with the package and are in a configuration compatible with test, burn-in and handling equipment for conventional integrated circuit packages, the layer of elastomeric material urging the second end portion of each contact element against an interconnect pad and permitting individual movement of each contact element for facilitating engagement of respective contact elements and interconnect pads and lead means carried by the engagement means and secured to the first end portions of the contact elements for electrically connecting the contact elements with the leads of the package.