Lead frame and process of producing such a frame
AssigneeShinko Electric Industries Co., Ltd.
InventorsKenichiro Tsuchiya, Toshiaki Ishizaki, Masahiro Iwabuchi
Life of this patent
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Abstract
A lead frame includes a plurality of inner leads, each of the inner leads having at least one surface defining a bonding area and two opposed side edges. The tip ends of the plurality of inner leads are connected by a connecting part so that the inner leads are arranged side by side with respect to each other. The connecting part is integrally and simultaneously formed with the inner leads by an etching process. Each of the inner leads has recesses on the two side edges at a position, between the bonding area and the connecting part, on a cutting line along which the plurality of inner leads are to be cut and separated into individual inner leads.
Claims5
A process for making a lead frame used in a semiconductor device, comprising the steps of:
- etching a metal foil, having a first surface and a second surface opposed to said first surface, to form a lead frame body comprising a plurality of inner leads, each of said inner leads having at least one bonding area on said first surface and two opposed side surfaces, and a connecting part connecting tip ends of said plurality of inner leads so as to be arranged side by side with respect to each other;
- forming at least one recess, which reduces a width of the inner lead, on at least one of said two side surfaces at a position, between said boding area and said connecting part, on a cutting line, said recess forming step being simultaneously conducted with said etching step;
- and
- cutting said lead frame body along said cutting line to separate said plurality of the tips of the inner leads into individual inner leads.
Dependencies are inferred from the claim text.