Low voltage coefficient polysilicon capacitor
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsMing-Hsung Chang, Jiue-Wen Weng
Life of this patent
Estimating the term…
Loading patent…
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsMing-Hsung Chang, Jiue-Wen Weng
Estimating the term…
A method for forming a low voltage coefficient capacitor within an integrated circuit. Formed upon a semiconductor substrate is a first polysilicon layer. Formed directly upon the first polysilicon layer is an Inter Polysilicon Dielectric (IPD) layer. Formed directly upon the Inter Polysilicon Dielectric (IPD) layer is a second polysilicon layer. The first polysilicon layer and the second polysilicon layer each have a resistivity no greater than about 40 ohms per square. Formed directly upon the second polysilicon layer is an amorphous silicon layer. Formed directly upon the amorphous silicon layer is a metal layer which is capable of forming a metal silicide with the amorphous silicon layer. The thickness of the metal layer and the thickness of the amorphous silicon layer are chosen to form a stoichiometric metal silicide with minimal consumption of the polysilicon layer. Finally, the semiconductor substrate is annealed to form a metal silicide layer from the amorphous silicon layer and the metal layer.
A method for forming a polysilicon electrode for use within a polysilicon capacitor comprising:
A method for forming a double layer polysilicon capacitor comprising:
A method for forming a double layer polysilicon capacitor within an integrated circuit comprising:
Dependencies are inferred from the claim text.