Method of metallizing a diamond substrate without using a refractory metal

Abstract

A method of metallizing a diamond substrate without using a refractory metal by firing the diamond substrate at approximately 850.degree. C. for ten minutes in order to de-hydrogenate and oxidize the surface of the diamond substrate; applying any suitable metal such as gold, silver, or copper in any suitable form as an interconnect layer to the diamond substrate using any suitable technique such as thick-film or direct-write; drying the interconnect layer on the diamond substrate at approximately 150.degree. C. for fifteen minutes in order to remove any volatile solvent that may be contained within the interconnect layer; and firing the diamond substrate and the interconnect layer at approximately 850.degree. C. for ten minutes in order to adhere the interconnect layer to the diamond substrate.

Dependencies are inferred from the claim text.