Integrated circuit package
AssigneesFujitsu Limited, Pfu Limited
InventorsTadashi Katsui, Katsuhiko Nakata, Takashi Kitahara
Life of this patent
Estimating the term…
Abstract
The integrated circuit package includes a package body, an integrated circuit chip enclosed airtight in the package body, a lead provided at a lower portion of the package body for connecting the integrated circuit chip to an external circuit, and air blasting means for cooling the package body by forced air cooling. The package body has, at an upper portion thereof, a heat radiation region formed from a fin and an air blasting region in which the air blasting means is disposed. A ventilation flue is formed between the heat radiation region and the air blasting region. This package is particularly superior in its heat radiation properties.
Claims12
An integrated circuit package comprising:
- a package body having a cover secured to it so as to close up the upper portion of said package body;
- an integrated circuit chip enclosed airtight in said package body;
- air blasting means for cooling said package body by forced air cooling, said air blasting means comprising a fan assembly secured to said cover of said package body;
- said package body further having, at an upper portion thereof, a heat radiation region provided with a plurality of fins projecting from an upper surface of said package body, and an air blasting region in which said air blasting means is disposed, said upper surface being divided by said heat radiation region and said air blasting region;
- and
- a ventilation flue formed between said heat radiation region and said air blasting region of said package body.
An integrated circuit package comprising:
- a package body;
- an integrated circuit chip enclosed airtight in said package body;
- air blasting means comprising a fan assembly for cooling said package body by forced air cooling;
- said package body having, at an upper portion thereof, a heat radiation region provided with a plurality of fins projecting from an upper surface of said package body, and an air blasting region in which said air blasting means is disposed, said upper surface being divided by said heat radiation region and said air blasting region;
- and
- a ventilation flue formed between said heat radiation region and said air blasting region of said package body;
- wherein the center of said fan assembly is offset from the center of heat generation of said package body.
Dependencies are inferred from the claim text.