Printed wiring board and method of manufacturing in which a basefilm including conductive circuits is covered by a cured polyimide resin lay
AssigneeCMK Corporation
InventorsHiromoto Sato, Junzaburo Shirai
Life of this patent
Estimating the term…
Abstract
A prepreg having an opening portion is placed on a cover lay which covers conductive circuits formed on a basefilm. A copper foil sheet is placed on the prepreg in such a way that the copper foil sheet covers the opening portion. The copper foil sheet has no opening portion. Next, the basefilm, the prepreg, and the copper foil are thermocompressed to become one laminate. After making a hole in the laminate, the laminate is plated, and then a through-hole is formed. A conductive circuit is formed by etching the copper foil sheet.
Claims14
A printed wiring board comprising:
- a basefilm having at least one conductive circuit on both surfaces;
- at least two cover lays, which completely cover both surfaces of said basefilm, and which are made by curing a semirigid bonding sheet made from polyimide-containing resin material
- at least two prepregs having opening portions which are laminated onto said at least two cover lays;
- and
- at least one conductive circuit formed by etching at least two copper foil sheets which completely covers said at least two prepregs.
A method of manufacturing a printed wiring board comprising:
- a first step in which a prepreg having an opening portion is placed on a cover lay which covers at least one conductive circuit formed on a basefilm, together with a copper foil sheet which is placed on the said prepreg in such a way that the said opening portion is covered with said copper foil sheet;
- a third step in which at least one hole is made to pierce said laminated layers;
- a fourth step in which said laminated layers having said at least one hole are plated;
- and
- a fifth step in which at least one conductive circuit is formed on said copper foil sheet by etching.
A printed wiring board comprising:
- a basefilm having at least one conductive circuit on both surfaces;
- at least two cover lays, which completely cover both surfaces of said basefilm, and which are made by curing a semirigid bonding sheet made from polyimide-containing resin material;
- at least two first prepregs having opening portions which are laminated onto said at least two cover lays;
- at least two rigid board having opening portions which are laminated onto said at least two first prepregs;
- at least two second prepregs having opening portions which are laminated onto said at least two rigid boards;
- at least one conductive circuit formed by etching at least two copper foil sheets which completely cover said at least two second prepregs.
A method of manufacturing a printed wiring board comprising:
- a first step in which a first prepreg, a rigid board, and a second prepreg are placed on a cover lay, which covers at least one conductive circuit formed on a basefilm, in such a way that opening portions formed on said first prepreg, said rigid board, and said second prepreg are substantially overlapped, together with a copper foil sheet which is placed on said second prepreg in such a way that said copper foil sheet covers said opening portions;
- a second step in which said basefilm, said first prepreg, said rigid board, said second prepreg, and said copper foil sheet are thermocompressed to become laminated layers;
- a third step in which at least one hole is made to pierce said laminated layers;
- a fourth step in which said laminated layers having said hole are plated;
- and
- a fifth step in which at least one conductive circuit is formed in said copper foil sheet by etching.
Dependencies are inferred from the claim text.