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US 5,628,645 AGranted
IC socket
AssigneeYamaichi Electronics Co., Ltd.
InventorsNoriyuki Matsuoka, Kazumi Uratsuji
Life of this patent
Estimating the term…
Abstract
An IC socket includes a socket body, an IC package receiving portion formed in the socket body and adapted to receive an IC package therein, a plurality of contacts arranged in array along the IC package receiving portion, and a contact opening/closing cover overlying the socket body. The contacts are displaced between a position for contacting leads of the IC package and a position for removing the contacting relation upon upward and downward movements of the contact opening/closing cover. The IC socket further includes a positioning member which is displaced in the same direction as the contacts in upon the upward and downward movements of the contact opening/closing cover, so as to regulate the portions of the contacts in the neighborhood of a contacting portion of each contact.
Claims20
An IC socket for use with an IC package having an IC body and IC leads, said IC socket comprising:
- a socket body having an IC package receiving portion;
- a plurality of contacts mounted to said socket body and arranged in array along said IC package receiving portion of said socket body, each of said contacts including a spring portion and a projecting contacting portion supported by said spring portion so as to be movable between an IC lead contacting position and an IC lead non-contacting position, said IC lead non-contacting position being spaced outwardly of said IC lead contacting position from said IC package receiving portion;
- a contact opening/closing cover, mounted over said socket body for movement between a raised position and a lowered position relative thereto, for causing movement of said contacting portions of said contacts from said IC contacting positions to said IC non-contacting positions;
- a positioning member movably mounted to said socket body for movement between a first position and a second position spaced outwardly of said first position from said IC package receiving portion, said positioning member comprising a plurality of spaced apart regulating pieces, each of which is interposed between respective contacting portions of an adjacent pair of said contacts when said positioning member is in said first position;
- wherein said positioning member further includes a plurality of spaced apart fins extending outwardly from said positioning member, said regulating pieces being respectively mounted at distal ends of said fins;
- and
- wherein each of said fins is interposed between an adjacent pair of said contacts.
4 more elements
An IC socket for use with an IC package having an IC body and IC leads, said IC socket comprising;
- a socket body having an IC package receiving portion adapted to receive the IC package;
- a plurality of contacts mounted to said socket body and arranged in array along said IC package receiving portion of said socket body, each of said contacts including a spring portion and a projecting contacting portion supported by said spring portion so as to be movable between an IC lead contacting position and an IC lead non-contacting position, said IC lead non-contacting position being spaced outwardly of said IC lead contacting position from said IC package receiving portion, said contacting portions of said contacts being respectively aligned and contacted with the IC leads of the IC package when the IC is disposed in said IC package receiving portion and said contacting portions are disposed in their IC lead contacting positions;
- a contact opening/closing cover, mounted over said socket body for movement between a raised position and a lowered position relative thereto, for causing movement of said contacting portions of said contacts from said IC contacting positions to said IC non-contacting positions;
- and
- a positioning member movably mounted to said socket body for movement between a first position and a second position spaced outwardly of said first position from said IC package receiving portion, said positioning member comprising a plurality of spaced apart regulating pieces, each of which is positioned so as to be interposed directly in a space between an adjacent pair of the IC leads of the IC package when the IC package is received in said IC package receiving portion and said positioning member is in said first position so as to regulate the positions of the IC leads for alignment with said contacts, respectively.
2 more elements
An IC socket for use with an IC package having an IC body and IC leads, said IC socket comprising:
- a socket body having an IC package receiving portion adapted to receive the IC package;
- a plurality of contacts mounted to said socket body and arranged in array along said IC package receiving portion of said socket body, each of said contacts including a spring portion and a projecting contacting portion supported by said spring portion so as to be movable between an IC lead contacting position and an IC lead non-contacting position, said IC lead non-contacting position being spaced outwardly of said IC lead contacting position form said IC package receiving portion, said contacting portions of said contacts being respectively aligned and contacted with the IC leads of the IC package when the IC is disposed in said IC package receiving portion and said contacting portions are disposed in their IC lead contacting positions;
- a contact opening/closing cover, mounted over said socket body for movement between a raised position and a lowered position relative thereto, for causing movement of said contacting portions of said contacts from said IC contacting positions to said IC non-contacting positions;
- and
- a positioning member movably mounted to said socket body for movement between a first position and a second position spaced outwardly of said first position from said IC package receiving portion, said positioning member comprising a plurality of spaced apart regulating pieces, each of which is positioned so as to be interposed directly in a space between an adjacent pair of the IC leads of the IC package and between an adjacent pair of said contacting portions respectively aligned with the adjacent pair of the IC leads when the IC package is received in said IC package receiving portion and said positioning member is in said first portion so as to regulate the positions of the IC leads for alignment with said contacts, respectively.
2 more elements
Dependencies are inferred from the claim text.