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US 5,626,681 AGranted
Method of cleaning semiconductor wafers
AssigneeShin-Etsu Handotai Co., Ltd.
InventorsMasami Nakano, Isao Uchiyama, Hiroyuki Takamatsu
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Abstract
An improved semiconductor wafer cleaning method capable of cleaning wafers without degrading the surface roughness of the wafers includes the steps of cleaning a polished wafer with an aqueous solution of hydrofluoric acid, then rinsing the wafer with ozone-containing water, and thereafter brush-scrubbing the wafer.
Claims4
A semiconductor wafer cleaning method comprising the steps of:
- (a) cleaning a polished surface of a wafer, comprising silicon with an aqueous solution comprising hydrofluoric acid;
- (b) then, rinsing the wafer with a rinsing composition consisting essentially of water and ozone;
- and
- (c) thereafter, brush-scrubbing the wafer.
1 more element
Dependencies are inferred from the claim text.