Hot melt adhesive having controlled property change
AssigneeH. B. Fuller Licensing & Financing, Inc.
InventorsWilliam L. Bunnelle, Christopher M. Ryan
Life of this patent
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Abstract
The novel adhesives of this invention contain a blend of components that result in the adhesive having a physical property that changes at a controlled rate as a function of time after application until it reaches a final equilibrium value. The adhesives can contain a thermoplastic polymer base, a tackifying resin, and an aromatic plasticizer optionally in combination with other ingredients. The plasticizer tackifier combination is chosen such that the tackifier/plasticizer interaction causes the initial value of the physical property after application to change, at a controlled rate, to a final equilibrium level.
Claims27
A hot melt adhesive composition comprising:
- (a) about 5 to 50 wt-% of a plasticizer comprising a cycloaliphatic or aromatic ester of a benzene dicarboxylic acid or a cycloaliphatic polyester of aromatic carboxylic acids, which is a solid at room temperature;
- (b) about 20 to 80 wt-% of a tackifier selected from the group consisting of an aromatic tackifying resin, aromatic-aliphatic tackifying resin, aliphatic tackifying resin and a rosin derived tackifying resin, and mixtures thereof;
- and
- (c) about 0 to 55 wt-% of a thermoplastic polymer;
- wherein the composition, after application and cooling, cold flows for a controllable period of time at ambient temperature prior to subsequently increasing in modulus (G').
A hot melt adhesive composition comprising:
- (a) about 5 to 40 wt-% of a cyclohexane dimethanol dibenzoate plasticizer compound;
- (b) about 20 to 80 wt-% of a tackifier selected from the group consisting of an aromatic tackifying resin, aromatic-aliphatic tackifying resin, aliphatic tackifying resin and rosin derived tackifying resin, and mixtures thereof;
- and
- (c) about 0.1 to 15 wt-% of a thermoplastic ethylene-vinyl acetate copolymer;
- wherein the composition, after application, cold flows for a controllable period of time at ambient temperature prior to subsequently increasing in modulus (G').
A hot melt adhesive composition comprising:
- (a) about 5 to 40 wt-% of a cyclohexane dimethanol dibenzoate plasticizer;
- (b) about 20 to 80 wt-% of a tackifier selected from the group consisting of an aromatic tackifying resin, aromatic-aliphatic tackifying resin, aliphatic tackifying resin and rosin derived tackifying resin, and mixtures thereof;
- and
- (c) about 5 to 35 wt-% of a thermoplastic block copolymer;
- wherein the composition, after application, cold flows for a controllable period of time at ambient temperature prior to subsequently increasing in modulus (G').
A hot melt adhesive composition comprising:
- (a) about 5 to 50 wt-% of a cyclohexane dimethanol dibenzoate plasticizer;
- (b) about 20 to 80 wt-% of a tackifier selected from the group consisting of an aromatic tackifying resin, aromatic-aliphatic tackifying resin, aliphatic tackifying resin, a rosin derived tackifying resin, and mixtures thereof;
- and
- (c) about 0.1 to 55 wt-% of a thermoplastic polymer;
- wherein the composition, after application and cooling, cold flows for a controllable period of time at ambient temperature prior to subsequently increasing in modulus (G').
A hot melt adhesive composition comprising:
- (a) about 5 to 40 wt-% of a cyclohexane dimethanol dibenzoate plasticizer compound;
- (b) about 20 to 80 wt-% of a tackifier selected from the group consisting of an aromatic tackifying resin, aromatic-aliphatic tackifying resin, aliphatic tackifying resin and rosin derived tackifying resin, and mixtures thereof;
- and
- (c) about 0.1 to 15 wt-% of a thermoplastic ethylene-vinyl acetate copolymer;
- wherein the composition, after application, cold flows for a controllable period of time at ambient temperature prior to subsequently increasing in modulus (G').
Dependencies are inferred from the claim text.