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AssigneeDow Corning Corporation
InventorsClayton R. Bearinger, Robert C. Camilletti, Jack S. Kilby, Loren A. Haluska, Keith W. Michael
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A method and composition for joining flip chips back-side-up with respect to substrates by applying an adhesive between the active side of the flip chip and the substrate. The adhesive is a conductive silicone pressure sensitive adhesive containing (i) a silicone resin, (ii) a siloxane gum, (iii) a conductive particulate material, and optionally, (iv) a peroxide catalyst. Suitable conductive particulate materials are silver-clad glass fibers; spherical gold particles; spherical hollow glass microspheres coated with silver, gold, nickel, or copper; or spherical particles of metal alloys of Sn/Cu, Pb/Sn, or Au/Sn. The adhesive can be applied as a ball or bump itself, in conjunction with a solder ball or bump, or in the form of tape sandwiched between the flip chip and substrate.
A method of joining a chip to a substrate comprising positioning a flip chip back-side-up with respect to a substrate, wherein an electrical connection can be made between the circuits on the flip chip and the substrate, applying an adhesive between the active side of the flip chip and the substrate, the adhesive being an electrically conductive silicone pressure sensitive adhesive containing (i) a silicone resin, (ii) a siloxane gum, (iii) a conductive particulate material, and optionally (iv) a peroxide catalyst, and joining the flip chip and the substrate with the conductive silicone pressure sensitive adhesive therebetween.
Dependencies are inferred from the claim text.