High power dissipation plastic encapsulated package for integrated circuit die

An integrated circuit assembly, comprising:

• a block of thermally conductive material having a thin surface layer of an electrically insulative material of a predetermined thickness, said block including a stepped structure having a base and a protrusion from said base;
• a lead frame attached to a surface of said base of said stepped structure;
• and
• a resinous encapsulation for said block and said lead frame, said resinous encapsulation interlocking the stepped structure of said block, thereby minimizing displacement of said block within said resinous encapsulation, said resinous encapsulation positioning a surface of said protrusion of said stepped structure on an opposite side of said surface of said base of said stepped structure, so as to transfer heat generated at said lead frame out of said integrated circuit assembly through said surface of said protrusion of said stepped structure.

An integrated circuit assembly, comprising:

• a block of electrically and thermally conductive material forming a heat sink, said block including a stepped structure having a base and a protrusion from said base;
• a thin layer of anodized aluminum selectively formed on a surface of said base of said stepped structure;
• a lead frame attached to said heat sink, such that said thin layer of anodized aluminum selectively insulating said lead frame from said heat sink;
• and
• a resin encapsulation for said block and said lead frame, said resinous encapsulation interlocking the stepped structure of said block, thereby minimizing displacement of said block within said resinous encapsulation, said resinous encapsulation positioning a surface of said protrusion of said stepped structure on an opposite side of said surface of said base of said stepped structure, so as to transfer heat generated at said lead frame out of said integrated circuit assembly through said surface of said protrusion of said stepped structure.

An integrated circuit assembly, comprising:

• a block of thermally and electrically conductive material, including steel, forming a heat sink, said heat sink including a stepped structure having a base and a protrusion from said base;
• a layer of electrically insulative porcelain selectively provided on a surface of said base of said stepped structure;
• a lead frame attached to said block, such that said layer of electrically insulative porcelain selectively insulating said block from said lead frame;
• and
• a resinous encapsulation for said block and said lead frame, said resinous encapsulation interlocking the stepped structure of said block, thereby minimizing displacement of said block within said resinous encapsulation, said resinous encapsulation positioning a surface of said protrusion of said stepped structure on an opposite side of said surface of said base of said stepped structure, so as to transfer heat generated at said lead frame out of said integrated circuit assembly through said surface of said protrusion of said stepped structure.

An integrated circuit assembly, comprising:

• a block of thermally and electrically conductive material forming a heat sink, said heat sink including a stepped structure having a base and a protrusion from said base;
• a layer of fired glass selectively provided on a surface of said base of said stepped structure;
• a lead frame attached to said block, such that said layer of fired glass selectively insulating said block from said lead frame;
• and
• a resinous encapsulation for said block and said lead frame, said resinous encapsulation interlocking the stepped structure of said block, thereby minimizing displacement of said block within said resinous encapsulation, said resinous encapsulation positioning a surface of said protrusion of said stepped structure on an opposite side of said surface of said base of said stepped structure, so as to transfer heat generated at said lead frame out of said integrated circuit assembly through said surface of said protrusion of said stepped structure.

An assembly comprising:

• a lead frame;
• a heat sink composed of a thermally conductive material, said heat sink including a stepped structure having a base and a protrusion from said base, so as to have a top surface on said protrusion and a bottom surface on said base, said top surface being substantially parallel to and smaller in size than said bottom surface;
• a layer, having a predetermined thickness, of thermally conductive and electrically insulative material selectively provided on said bottom surface of said heat sink for electrically insulating said heat sink from selected portions of said lead frame;
• and
• a resinous encapsulation for said lead frame and said heat sink, said resinous encapsulation interlocking said stepped structure so as to secure said heat sink in said resinous encapsulation while exposing said top surface flush with a surface of said resinous encapsulation.