Method for inspecting a semiconductor device

A method for inspecting a semiconductor device comprising the steps of:

• providing an semiconductor die having a plurality of wire bonds;
• providing a computer having a memory and having a monitor;
• providing an inspection station having a handling system for moving the semiconductor die, a microscope for viewing the semiconductor die, and a camera coupled to the microscope and the monitor to portray a magnified image of the semiconductor die on the monitor;
• using the handler to position the semiconductor die in a field of view of the microscope;
• displaying the magnified image of the semiconductor die on the monitor;
• retrieving a template of a wire bond configuration from the memory of the computer;
• displaying an image of the template on the monitor, superimposed on the magnified image of the emiconductor die;
• and
• comparing the semiconductor die and the plurality of wire bonds to the template to see if the semiconductor die is properly wire bonded.

A method of inspecting a semiconductor device comprising the steps of:

• providing a semiconductor die having a plurality of bond pads formed on a surface;
• providing a plurality of leads and a die flag;
• mounting the semiconductor die to the die flag;
• wire bonding a plurality of wire bonds between the plurality of bond pads and the plurality of leads to create a wire bonded die;
• and
• inspecting the plurality of wire bonds for accuracy of configuration, wherein the step of inspecting comprises the steps of:
• positioning the wire bonded die on a stage within a field of view of a microscope;
• transmitting a magnified image of the wire bonded die from the microscope to a monitor using a camera;
• retrieving a template file from a computer readable memory;
• using the template file to display an image of a wire bond template on the monitor superimposed onto the magnified image of the wire bonded die, wherein the image of the wire bond template has a transparent region outlining an area of the wire bonded die which is supposed to include at least one wire bond, and wherein the magnified image of the wire bonded die is visible on the monitor within the transparent region.

A method for inspecting a semiconductor device comprising the steps of:

• providing a semiconductor die having a plurality of sides, each side having a height;
• providing a substrate;
• mounting the semiconductor die to the substrate using a die attach material, wherein the step of mounting creates a die attach material bondline along each side of the semiconductor die;
• and
• inspecting a location of the die attach material bondline,
• wherein the step of inspecting comprises the steps of:
• positioning one side of the semiconductor die within a field of view of a microscope;
• transmitting a magnified image of the one side from the microscope to a monitor;
• retrieving a template file from a computer readable memory;
• and
• using the template file to display an image of a bondline template on the monitor, superimposed onto the magnified image of the one side of the semiconductor die, wherein the image of the bondline template has a transparent region appoximately corresponding in position and size to the one side as magnified and has a first opaque line corresponding to an acceptable location of the die attach material bondline, and wherein the magnified image of the one side is visible on the monitor within the transparent region.

A method for inspecting a semiconductor device comprising the steps of:

• providing a packaged semiconductor device having a plurality of external leads;
• and
• inspecting a position of each lead of the plurality of external leads, the step of inspecting comprising the steps of:
• positioning the packaged semiconductor device within a field of view of a microscope such that all leads of the plurality of external leads are visible within the field of view;
• transmitting a magnified image of the packaged semiconductor device from the microscope to a monitor;
• retrieving a template file from a computer readable memory;
• generating a template image from the template file, wherein the template image includes a transparent region defining a boundary of an acceptable, lead location;
• and
• displaying the template image on the monitor, superimposed on the magnified image of the packaged semiconductor device such that at least one lead is visible on the monitor through the transparent region.